A silicon wafer has a total of 400 integrated circuits (ICs) at the beginning of its fabrication sequence. A total of 80 operations are used to complete the integrated circuits, each of which inflicts damages on 1.5% of the ICs. The damages compound, meaning that an IC that is already damaged has the same probability of being damaged by a subsequent process as a previously undamaged IC. How many defect-free ICs remain at the end of the fabrication sequence?