Question

Refer to the National Semiconductor study of manufactured silicon wafer integrated circuit chips, Exercise. Recall that the failure times of the microchips (in hours) were determined at different solder temperatures (degrees Centigrade). The data are repeated in the table below and saved in the WAFER file.
a. Fit the straight-line model E(y) = β0 + β1x to the data, where y = failure time and x = solder temperature.
b. Compute the residual for a microchip manufactured at a temperature of 152°C.
c. Plot the residuals against solder temperature (x). Do you detect a trend?
d. In Exercise, you determined that failure time (y) and solder temperature (x) were curvilinearly related. Does the residual plot, part c, support this conclusion?
Temperature (°C) Time to Failure (hours)
165 .............. 200
162 .............. 200
164 .............. 1,200
158 .............. 500
158 .............. 600
159 .............. 750
156 .............. 1,200
157 .............. 1,500
152 .............. 500
147 .............. 500
149 .............. 1,100
149 .............. 1,150
142 .............. 3,500
142 .............. 3,600
143 .............. 3,650
133 .............. 4,200
132 .............. 4,800
132 .............. 5,000
134 .............. 5,200
134 .............. 5,400
125 .............. 8,300
123 .............. 9,700


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  • CreatedMay 20, 2015
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