A scheme for dissipating heat from an array of N = 100 integrated circuits involves joining the
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A scheme for dissipating heat from an array of N = 100 integrated circuits involves joining the circuits to the bottom of a plate and exposing the top of the plate to a water bath. The water container is of length L = 100 Hun on a side and is exposed to airflow at its top surface. The flow is turbulated by the protruding lip of the side wall.
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If the sides and bottom of the container are well insulated from the surroundings and heat is uniformly dissipated in each circuit, at what rate may heat be dissipated from each circuit when the water temperature is maintained at Tb = 350 K?
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KNOWN Temperature of water bath used to dissipate heat from 100 integrated circuits Air flow conditi...View the full answer
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Related Book For 
Fundamentals of Heat and Mass Transfer
ISBN: 978-0471457282
6th Edition
Authors: Incropera, Dewitt, Bergman, Lavine
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