Study the excerpt from the Micron data flyer (2010, p. 9). Describe the designer’s use of alignment as a design principle. How effective is it? How would you modify it? Present your analysis and recommendations in a brief memo to your instructor.

Transcribed Image Text:

Micron CSN-16: Micron Component and Module Packaging Pin 1 Orientation for Tray and Tape-and-Reel Packaging Pin 1 Orientation for Tray and Tape-and-Reel Packaging Hinders in location of the fint lead nehallinsale semidor device and d to determe a port hattached to a circuit board in a camper on the topside of cach Micman die pin is indicated by an indentation cleaneded t molded Motis diced by a mirk geclically a iner-erhedder al de M This sean explains the locations of the pin 1 andinn on M Location of Pin 1 in Tray Packaging Murentypes of trays with varying colors for shipping p How rackay lasa single berekel comer at indicates the directi nach device. Blanding on the package type and she design of the part dep Indicate will be load in one of the two cores of the device ese closest the Figure 1: P10 1 Derection on Trays Location of Pin 1 in Tape-and-Reel Packaging Depp and design devices shipped is tape-an carriers are paid that the pain indicator ach device and in one of the become that the edge of the carrier tape with the und sprock gar 11 anpage 10 states the position of the pin India and