Electroplating is used to deposit the copper metal lines in integrated circuit processing. In this case, dissolution of a copper anode is used to provide cupric ions (Cu2+) for reaction; that is, the solid copper–cupric ion reaction is used both at the anode to generate cupric ions and at the cathode to grow the resulting fi lm. Calculate the minimum electrode potential to achieve copper growth for the following cell:

Assume the following:
(a) It is an ideal solution.
(b) Equation (9.38) represents the activity coeffi cient of copper.

Transcribed Image Text:

Cu(s) CuSO4(1, 0.1 m)||CuSO4(1, 0.01 m) Cu(s).