The target thickness for silicon wafers used in a type of integrated circuit is 245 m. A

The target thickness for silicon wafers used in a type of integrated circuit is 245 μm. A sample of 50 wafers is obtained and the thickness of each one is determined, resulting in a sample mean thickness of 246.18 μm and a sample standard deviation of 3.60 μm. Does this data suggest that true average wafer thickness is something other than the target value? Test at the .10 level.