Three different C2F6 flow rates (SCCM) were considered in an experiment to investigate the effect of flow

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Three different C2F6 flow rates (SCCM) were considered in an experiment to investigate the effect of flow rate on the uniformity (%) of the etch on a silicon wafer used in the manufacture of integrated circuits, resulting in the following data:

Compare and contrast the uniformity observations resulting from these three different flow rates.

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Modern Mathematical Statistics With Applications

ISBN: 9783030551551

3rd Edition

Authors: Jay L. Devore, Kenneth N. Berk, Matthew A. Carlton

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