Figure below shows a schematic of multilayer interconnect for a CMOS chipset. Consider the upper layer...

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Figure below shows a schematic of multilayer interconnect for a CMOS chipset. Consider the upper layer of metal has the following parameters of w=0.75 μm, tdi 0.45 μm, r=0.5 um, and s= 0.2 µm. Assume Ex= 3.9 and & 88.5 fF/ μm. a. Determine the Capacitances of Carea, Clateral, and Cfringe b. Calculate the capacitance of middle wire when wires are widely spaced. HH Metal2 HEA Cringe area Metall 4-11 Substrate Figure below shows a schematic of multilayer interconnect for a CMOS chipset. Consider the upper layer of metal has the following parameters of w=0.75 μm, tdi 0.45 μm, r=0.5 um, and s= 0.2 µm. Assume Ex= 3.9 and & 88.5 fF/ μm. a. Determine the Capacitances of Carea, Clateral, and Cfringe b. Calculate the capacitance of middle wire when wires are widely spaced. HH Metal2 HEA Cringe area Metall 4-11 Substrate

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To calculate the capacitances in the given multilayer interconnect structure we need to consider the ... View the full answer