. **Question 1 Consider a truss structure composed of various interconnected members, subjected to both point...
Question:
. **Question 1
Consider a truss structure composed of various interconnected members, subjected to both point loads and distributed loads. The material properties of each member are known. Design a systematic approach to perform a comprehensive structural analysis, taking into account factors such as external loading, member geometry, and support conditions. Explain how the method of joints and the method of sections can be employed to analyze internal forces within the truss members. Discuss any assumptions made during the analysis and how they might affect the accuracy of the results.
. **Question 2
You are tasked with designing an efficient thermal management system for a high-performance electronic device. The device dissipates a significant amount of heat during operation. Discuss the various methods of heat transfer involved in this scenario, including conduction, convection, and radiation. Propose a suitable cooling solution, considering factors such as heat sink design, fan selection, and material properties. Discuss the trade-offs involved in choosing different cooling methods and how they impact the overall thermal performance of the electronic device. Additionally, address any challenges associated with maintaining thermal stability in real-world applications and propose possible solutions.