Go back

Reflow Soldering Processes And Troubleshooting SMT BGA CSP And Flip Chip Technologies(1st Edition)

Authors:

Ning-Cheng Lee

Free reflow soldering processes and troubleshooting smt bga csp and flip chip technologies 1st edition ning-cheng
8 ratings
Cover Type:Hardcover
Condition:Used

In Stock

Include with your book

Free shipping: April 23, 2024
Access to 3 Million+ solutions Free
Ask 10 Questions from expert 200,000+ Expert answers
7 days-trial

Total Price:

$0

List Price: $126.00 Savings: $126(100%)

Book details

ISBN: 0750672188, 008049224X, 9780750672184, 9780080492247

Book publisher: Newnes