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The Simulation Of Thermomechanically Induced Stress In Plastic Encapsulated Ic Packages(1st Edition)

Authors:

Gerard Kelly

Free the simulation of thermomechanically induced stress in plastic encapsulated ic packages 1st edition gerard
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Cover Type:Hardcover
Condition:Used

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Book details

ISBN: 0792384857, 1461550114, 9780792384854, 9781461550112

Book publisher: Springer