Dimethylolpropionic acid, shown below, is used in the preparation of resins. Represent the bonding in the dimethylolpropionic

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Dimethylolpropionic acid, shown below, is used in the preparation of resins.

0 CH3 HO C C CHOH CHOH

Represent the bonding in the dimethylolpropionic acid molecule by using the method in Figure 11-19 to indicate hybridization schemes and orbital overlaps. What is the maximum number of atoms that can lie in the same plane?

Figure 11-19

TT: C(2p)-0(2p) H r: H(ls)C(sp2) _120 C-8 H 120 0: C(sp)-0(2p) [or, o: C(sp2)-0(sp)]

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General Chemistry Principles And Modern Applications

ISBN: 9780132931281

11th Edition

Authors: Ralph Petrucci, Jeffry Madura, F. Herring, Carey Bissonnette

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