Plasma etching is essential to the fine-line pattern transfer in semiconductor processes. The article Ion Beam- Assisted
Question:
The summary statistics are (xi = 24.0, (yi = 312.5, (x2i = 70.50, (xiyi = 902.25, (y2i = 11,626.75, 0 = 6.448718, 0 = 10.602564.
a. Does the simple linear regression model specify a useful relationship between chlorine flow and etch rate?
b. Estimate the true average change in etch rate associated with a 1-SCCM increase in flow rate using a 95% confidence interval, and interpret the interval.
c. Calculate a 95% CI for µY.3.0, the true average etch rate when flow = 3.0. Has this average been precisely estimated?
d. Calculate a 95% PI for a single future observation on etch rate to be made when flow = 3.0. Is the prediction likely to be accurate?
e. Would the 95% CI and PI when flow = 2.5 be wider or narrower than the corresponding intervals of parts (c) and (d)? Answer without actually computing the intervals.
f. Would you recommend calculating a 95% PI for a flow of 6.0? Explain.
Step by Step Answer:
Probability And Statistics For Engineering And The Sciences
ISBN: 9781305251809
9th Edition
Authors: Jay L. Devore