Question: 1. d) Describe the similarities and differences between the creep test and the tensile deformation test (3p). b) Are there differences between the schematic creep
1. d) Describe the similarities and differences between the creep test and the tensile deformation test (3p). b) Are there differences between the schematic creep curve used to define different stages of creep and real creep curves? (2p) c) Describe the tertiary creep stage and indicate its microscopic origin (1p) 2. a) What is 5 power-law creep? (1p) b) What is the crystalline structure of the materials obeying the 5 power-low creep? (2p) c) Describe the equations relating the applied creep stress to microstructure parameters at the steady state? (mention the physical significance of the notations involved). (3p) d) Propose a microstructure of a creep resistant crystalline material, which has to operate under 5 power-law creep conditions and explain the principles used as the basis of the design (suggestion: indicate how microstructural parameters influence the steady-state creep rate). (5p) 3. a) Describe what will happen with the material shown below at high temperature. b) Explain the microscopic processes taking place. (xx is a tensile stress applied along the x direction. The material contains one dislocation in the center.) (3p)
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