Question: 1. Technical description with pictures about: a. Solder paste printing process. b. Component placing process. c. Solder reflow process. Explain the thermal profile for reflow

1. Technical description with pictures about:

a. Solder paste printing process.

b. Component placing process.

c. Solder reflow process. Explain the thermal profile for reflow soldering and compare the profile of SnPb with SAC305

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