Question: 1. Technical description with pictures about: a. Solder paste printing process. b. Component placing process. c. Solder reflow process. Explain the thermal profile for reflow
1. Technical description with pictures about:
a. Solder paste printing process.
b. Component placing process.
c. Solder reflow process. Explain the thermal profile for reflow soldering and compare the profile of SnPb with SAC305
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