2. The Spansion Electronics operator performed visual inspection on semiconductor wafers after the dicing process. Non-conformities were found such as scratched, dented, chip and crack. Data is recorded in the table below Sample no. Non- Sample no. Non-conformance conformance 1 21 14 19 2 24 15 10 3 16 16 17 4 12 17 13 5 15 18 22 6 5 19 18 7 28 20 39 8 20 21 30 9 31 22 24 10 25 23 16 11 20 24 19 12 24 25 17 13 16 26 15 a) From the above data, find the control limit. b) Using all the data, construct a suitable control chart. c) Interpret the control chart. (4) (Total:20) [Maximum: 3 pages]