2) Why is test equipment calibration necessary? 3) State a challenge for in-line parametric testing. 4) List and explain the objectives of wafer sort. 5) Describe how wafer sort is performed. 6) List and describe three electrical tests typically done during wafer sort. 7) Explain how functional testing is conducted using test vectors. 8) Explain the concept of test coverage. 9) Describe how the zero-one algorithm is used for a functional test. 10) List four test issues that affect wafer sort. 11) Why are design for test (DFT) and parallel testing important for total test time? 12) Explain the single-stuck-at-fault (SSAF) model. 13) Explain the benefit of IDDQ testing. What is its drawback? 14) Discuss guardbanding and how in ensures the product specification is met. 15) What is wafer sort yield? 16) List and explain six factors that affect wafer sort yield. 17) List three yield models and give a short description of each one. 18) What is the name given for the back-end of the IC manufacturing process? 19) Give a short description of IC final assembly and IC packaging. 20) What is a printed circuit board (PCB)? 21) Describe how the die is separated from the wafer. 22) What is die attach? 1. 23)List and discuss the three types of chip bonding. 2. 24)State and discuss the three methods for wirebonding. 25) List the two most widely-used types of traditional IC packaging materials. 26) List and describe six different plastic packages