Question: 3. Consider a chip package similar to the case study as below. The die is dissipating 2 W. The thermal interface material is a 0.127

3. Consider a chip package similar to the case study as

3. Consider a chip package similar to the case study as below. The die is dissipating 2 W. The thermal interface material is a 0.127 mm thick layer of epoxy, and the mold compound is 2 mm thick. Assume that the printed wiring board is insulated and that conduction through the leads is negligible. Calculate the thermal resistance of the heat sink required to maintain the die temperature at 90C if the ambient temperature is 45 C. Also estimate the time that would be required for the die to reach this steady-state temperature. The silicon die is 1 cm x 1 cm and is 1 mm thick. The overall package size is 2 cm x 2 cm. The mold material has a thermal conductivity of 0.8 W/mK. The silicon and epoxy has a thermal conductivity of 120 W/mK and 0.35W/mK. The thermal time constant mCp 7hA is 4.485. Heat Sink MONO Encapsulant Thermal Grease Leads Wire Bonds Motherboard Die

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