Question: 3.10 The maximum pull rate in the CZ process can be modeled based on a heat balance model. The model predicts that the maximum pull
3.10 The maximum pull rate in the CZ process can be modeled based on a heat balance model. The model predicts that the maximum pull rate for a 150 mm (6 inch) diameter wafer is about 24 cm h-' about 24 cm h'. A manufacturer of silicon wafers uses CZ crystal pullers to produce 300 mm (12 inch) ingots. Estimate how long it takes this manufacturer to pull a crystal that is 3 m long
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