Question: 5 5. The lapping process which is used to grind certain silicon wafers to the proper thickness is acceptable only if o, the population standard

5. The lapping process which is used to grind certain silicon wafers to the proper thickness is acceptable only if o, the population standard deviation of thickness cut from the wafers, is at most 0.50 mil. Use the 0.05 level of significance to test this variability for a random sample of 15 that produces a standard deviation of 0.64 mil

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