8.6 A new circuit design is estimated to require a die which is 5 X 8 mm and will be fabricated on a wafer 125 mm in diameter. The process is achieving a defect density of 10 defects/cm, and the wafer processing cost is $250. (a) What will be the cost of the final product if testing and packaging adds $1.60 to the completed product? (b) The circuit design could be partitioned into two chips rather than one, but each die will increase in area by 15% in order to accommodate additional pads and I/O cir- cuitry. If the testing and packaging cost remains the same, what is the cost of the two-chip set? Base your answers on Eq. (8.8). (See Problem 8.4 for the number of dice per wafer.) 8.6 A new circuit design is estimated to require a die which is 5 X 8 mm and will be fabricated on a wafer 125 mm in diameter. The process is achieving a defect density of 10 defects/cm, and the wafer processing cost is $250. (a) What will be the cost of the final product if testing and packaging adds $1.60 to the completed product? (b) The circuit design could be partitioned into two chips rather than one, but each die will increase in area by 15% in order to accommodate additional pads and I/O cir- cuitry. If the testing and packaging cost remains the same, what is the cost of the two-chip set? Base your answers on Eq. (8.8). (See Problem 8.4 for the number of dice per wafer.)