An alternative name for chip in semiconductor processing is which one of the following $($one best

answer$)$: $($a$)$ component, $($b$)$ device, $($c$)$ die, $($d$)$ package, or $($e$)$ wafer? $(5$ point$)$

Answer.

$13.$ Which one of the following is the most common form of radiation used in photolithography: $(5$ point$)$

$($a$)$electronic beam radiation,

$($b$)$ incandescent light,

$($c$)$ infrared light,

$($d$)$ ultraviolet light,

$($e$)$ X$-$ray?

Answer.

$14.$ Which of the following are doping processes in IC fabrication $($two best answers$)$: $($a$)$ chemical

vapor deposition, $($b$)$ diffusion, $($c$)$ ion implantation, $($d$)$ physical vapor deposition, $($e$)$ plasma

etching, $($f$)$ thermal oxidation, and $($g$)$ wet etching? $(5$ point$)$

Answer.

$15.$ Which etching process produces the more anisotropic etch in IC fabrication:

$($a$)$ plasma etching or

$($b$)$ wet chemical etching? $(5$ point$)$