Background

You have been tasked by your direct supervisor (Sherye Latimer, Documentation Manager) to read over the BGA Manufacturers User Guide for Micron BGA Parts (Document 5.1). Sherye wants you to analyze the first page of the document to get a sense of the design approach that has been implemented. Once you have completed your analysis she has asked you to email her a report of your findings in a 1 page memo report.

Assignment

Read over Document 5.2 for an annotated example of a 1 page memo report and the Organizing a Memodocument for general memo guidelines.

While conducting your analysis you will want to consider and identify the various design elements that are present in the excerpt (i.e., use of alignment, chunking, use of color, etc.). How effective are each of the elements? How might the elements be modified to improve the effectiveness of the document?

CSN-33: Micron BGA Manufacturer's User Guide Micron Introduction BGA Manufacturer's User Guide for Micron BGA Parts Customer Service Note Introduction This customer service note provides information that will enable customers to easily integrate both leading-edge and legacy Micron ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. The recommendations and suggestions provided in this customer service note serve as a guideline to help the end user develop user-specific solutions. It is the responsibility of the end user to optimize the process to obtain the desired results Because the package landscape changes rapidly and information can become outdated very quickly, refer to the latest product specifications. Contact your sales representative for any additional questions not covered within this guide An overview of a typical BGA package and its components are shown in Figure 1. Figure 1 Ball Grid Array Package (Dual Die, Wine Bonded) Silicon die Wire bond (typically gold) Die attach layer or Mold compound tip chip with solder bumps PCB substrate Solder ball JEDEC Terminology This document uses JEDEC terminology. JEDEC-based BGA devices in the semiconductor industry are identified by two key attributes: Maximum package height (profile) Ball pitch For example: TFBGA-12mm package height and less than 1.0mm bal pitch Package descriptors F1 through F5 have been added to provide more detailed ball pitch information for devices with a ball pitch of less than 0.8mm Within the industry, many memory manufacturers continue to use only the F descriptor for any ball pitch of 10mmor less (500 JEDEC JESDOE for additional information) Maximum package height profile and ball pitch codes based on the JEDEC standard are shown in Tables 1 and 2 POSSONO www. Products and second here for evaluation and reference purposes only and are subject to change by Micron without notice. Products are only wartered by Micronment Micros production data pecifications CSN-33: Micron BGA Manufacturer's User Guide Micron Introduction BGA Manufacturer's User Guide for Micron BGA Parts Customer Service Note Introduction This customer service note provides information that will enable customers to easily integrate both leading-edge and legacy Micron ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. The recommendations and suggestions provided in this customer service note serve as a guideline to help the end user develop user-specific solutions. It is the responsibility of the end user to optimize the process to obtain the desired results Because the package landscape changes rapidly and information can become outdated very quickly, refer to the latest product specifications. Contact your sales representative for any additional questions not covered within this guide An overview of a typical BGA package and its components are shown in Figure 1. Figure 1 Ball Grid Array Package (Dual Die, Wine Bonded) Silicon die Wire bond (typically gold) Die attach layer or Mold compound tip chip with solder bumps PCB substrate Solder ball JEDEC Terminology This document uses JEDEC terminology. JEDEC-based BGA devices in the semiconductor industry are identified by two key attributes: Maximum package height (profile) Ball pitch For example: TFBGA-12mm package height and less than 1.0mm bal pitch Package descriptors F1 through F5 have been added to provide more detailed ball pitch information for devices with a ball pitch of less than 0.8mm Within the industry, many memory manufacturers continue to use only the F descriptor for any ball pitch of 10mmor less (500 JEDEC JESDOE for additional information) Maximum package height profile and ball pitch codes based on the JEDEC standard are shown in Tables 1 and 2 POSSONO www. Products and second here for evaluation and reference purposes only and are subject to change by Micron without notice. Products are only wartered by Micronment Micros production data pecifications