c) Use the SEED's model, if D=4 defects/cm, (i) What is the yield for: Chip A:...

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c) Use the SEED's model, if D=4 defects/cm², (i) What is the yield for: Chip A: • Chip B: a 1mm by 1mm a 7mm by 7mm a 1.2cm by 1.2cm • Chip C: ● (ii) How many good chips for "Chip A", "Chip B" and "Chip C" from a 6" wafer? (iii) If the packaging costs for "each" Chip A = £1.5; Chip B = £12 and Chip C = £35. The fabrication* cost of a 6" wafer is £400. Assume that an electronic system can use either 500 Chip A, or 120 Chip B, or 20 Chip C. Which is the most economic solution based on these packaging and processing costs? Fabrication is a manufacturing process. c) Use the SEED's model, if D=4 defects/cm², (i) What is the yield for: Chip A: • Chip B: a 1mm by 1mm a 7mm by 7mm a 1.2cm by 1.2cm • Chip C: ● (ii) How many good chips for "Chip A", "Chip B" and "Chip C" from a 6" wafer? (iii) If the packaging costs for "each" Chip A = £1.5; Chip B = £12 and Chip C = £35. The fabrication* cost of a 6" wafer is £400. Assume that an electronic system can use either 500 Chip A, or 120 Chip B, or 20 Chip C. Which is the most economic solution based on these packaging and processing costs? Fabrication is a manufacturing process.

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Key Information Model SEEDs model Defect density D 4 defectscm Chip dimensions Chip A1mm x 1mm Chip B7mm x 7mm Chip C12cm x 12cm Wafer size 6 Packaging costs per chip Chip A15 Chip B12 Chip C35 Fabric... View the full answer