Chips CONFIDENTIAL T epoxy TI 100 C Aluminum board Kboard 130 W/m C T=25 C h...

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Chips CONFIDENTIAL T epoxy TI 100 C Aluminum board Kboard 130 W/m C T=25 C h = 100 W/mK (a) Figure 2 (b) Aluminum board kboard 130 W/m C 22231/BMM3573 80 C QUESTION 2 = An aluminum board has several thin silicon chips that dissipate heat flux qo 10,000 W/m attached on the board wall's left side. The aluminum board has an effective thermal conductivity of kboard 130 W/m C. The thin silicon chips are set to be bonded onto a 1 cm thick, 10 cm high and 15 cm long aluminum board using a 2 mm thick epoxy joint (kepoxy = 1.8 W/m C). a) Draw the complete thermal resistance diagram for Figure 2(a) and determine the surface temperature T, when the right side of the board temperature is measured at 100 C. b) To ensure the chips are operating below their maximum allowable temperature of 85 C, the left side of the aluminum board is to be cooled by 25 C air, with a heat transfer coefficient of hair 100 W/m.C. Draw a new complete thermal resistance diagram for Figure 2(b) and evaluate the temperature of T, after the air cooling effect when the right side of the board temperature is now measured at 80 C. Discuss your answer. Chips CONFIDENTIAL T epoxy TI 100 C Aluminum board Kboard 130 W/m C T=25 C h = 100 W/mK (a) Figure 2 (b) Aluminum board kboard 130 W/m C 22231/BMM3573 80 C QUESTION 2 = An aluminum board has several thin silicon chips that dissipate heat flux qo 10,000 W/m attached on the board wall's left side. The aluminum board has an effective thermal conductivity of kboard 130 W/m C. The thin silicon chips are set to be bonded onto a 1 cm thick, 10 cm high and 15 cm long aluminum board using a 2 mm thick epoxy joint (kepoxy = 1.8 W/m C). a) Draw the complete thermal resistance diagram for Figure 2(a) and determine the surface temperature T, when the right side of the board temperature is measured at 100 C. b) To ensure the chips are operating below their maximum allowable temperature of 85 C, the left side of the aluminum board is to be cooled by 25 C air, with a heat transfer coefficient of hair 100 W/m.C. Draw a new complete thermal resistance diagram for Figure 2(b) and evaluate the temperature of T, after the air cooling effect when the right side of the board temperature is now measured at 80 C. Discuss your answer.