create a simscape for this problem please show the simscape screenshot. A cold plate is to be designed to cool a high$-$power GPU used in a data center for Al applications. The cold plate is to be machined from billet in two halves that come together, forming a channel for the coolant flow which then face seal with an o$-$ring gasket to contain the flow, allowing for easy cleaning and maintenance.

The coolant to be used is a minimum $30\backslash \%$ water ethylene glycol mixture to act as a corrosion inhibitor. The fluid must enter the cold plate through $\backslash (90^\{\backslash$circ$\}\backslash )$ angle fittings which are located at opposite ends of the block. The top piece is fitted with an acetal top, insulating heat flow to the surrounding air.

The GPU PCB has low copper utilization and is very thin. The GPU has a die size of $\backslash (680\backslash$mathrm$\{$~mm$\}^\{2\}\backslash )$ with a junction to case resistance of $\backslash (0\mathrm{.}7^\{\backslash$circ$\}\backslash$mathrm$\{$C$\}\backslash ).$ The TDP for the die is $350$ W with a junction limit of $\backslash (110^\{\backslash$circ$\}\backslash$mathrm$\{$C$\}\backslash ).$

Determine the required dimensions of the cold plate, modeling it as flow through a conduit. The external dimensions may not exceed the plan area of the PCB which is $11\mathrm{.}2"$x$4\mathrm{.}4".$

Specify the operating conditions of your design to ensure adequate cooling of the GPU. Sketch your design and include a pressure drop vs flow rate curve in units of mbar and Liters per hour at room temperature coolant conditions.