Question: describe the above method Physical Vapour Deposition Method (Sputtering Method) Bottom-up Approach. The material is evaporated in a vacuum. Substrate Target Vapour particles travel towards

describe the above method

Physical Vapour Deposition Method (Sputtering Method) Bottom-up Approach. The material is evaporated in a vacuum. Substrate Target Vapour particles travel towards the cold Material Magnet target (substrate) Deposited and condense back to a solid state. Sputtering evaporators atoms are ejected from a solid target Electron Vacuum Gun due to bombardment of the target by System Power Supply energetic electrons

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