Develop an accelerated life test (ALT) plan for estimating the reliability of An electronic component subjected to a temperature of 358 398K, voltage of 12 16 V, and humidity level of 0 30%.The plan should include the accelerated method, stress type (given) (temperature, mechanical stress, vibration, humidity, voltage, current etc.), stress levels (given), sample size, failure definition, data collection method, acceleration method, and data analysis method, which should be determined before data are collected. Justify the plan. Write this plan as a detailed proposal to your management. A minitab Life model should be created to predict the results. Determine the acceleration factor between lowest range to highest range for each stress type .

Project 3 Due Date: 4/19/2021

Develop an accelerated life test (ALT) plan for estimating the reliability of the following product listed according to your name. The plan should include the accelerated method, stress type (given) (temperature, mechanical stress, vibration, humidity, voltage, current etc.), stress levels (given), sample size, failure definition, data collection method, acceleration method, and data analysis method, which should be determined before data are collected. Justify the plan. Write this plan as a detailed proposal to your management. A minitab Life model should be created to predict the results. Determine the acceleration factor between lowest range to highest range for each stress type. Project is to be done according to name listed for each test plan.

1. A mechanical component at stress of 35 75 Nm, temperature of 15 25C, and frequency of 1 3 Hz.
2. Shelf-life testing of an adsorbent at -90 50C, 40 60% relative humidity, and weight change of 0 100 mmg.
3. Thermal shock chamber subjected to a temperature of -100 250C, humidity level of 10 40%, and vibration acceleration of 5 75 grms (root mean square acceleration).
4. An electronic component subjected to a temperature of 290 330K, current of 35 60 mA, and humidity level of 40 70%. (
5. An electronic component subjected to a temperature of 358 398K, voltage of 12 16 V, and humidity level of 0 30%.
6. An electronic component subjected to a temperature of 15 25C, current of 0.1 1 mA, and humidity level of 15 65%.
7. A printed circuit board subjected to a temperature of 15 25C, humidity level of 15 65%, and vibration acceleration of 1 5 grms (root mean square acceleration). (
8. A hot isostatic press at a pressure of 1000 10000 kPa, temperature of 15 25C, and humidity of 10 40%.

only No. 5