Question: Die yield = Wafer yield x 1/(1 + Defects per unit area x Die area) N Chip Die Size (mm 2) Estimated defect rate (per

Die yield = Wafer yield x 1/(1 + Defects per unit area x Die area) N

Chip

Die Size

(mm2)

Estimated defect rate

(per cm2)

N

Manufacturing size (nm)

Transistors

(billion)

Cores

BlueDragon

180

0.03

12

10

7.5

4

RedDragon

120

0.04

14

7

7.5

4

Phoenix

200

0.04

14

7

12

8

Figure 1.26

Please use the die yield formula with the N values provided in Figure 1.26 to answer the questions below:

a. What is the yield for the Phoenix chip?

b. Why does Phoenix have a higher defect rate than BlueDragon?

Step by Step Solution

There are 3 Steps involved in it

1 Expert Approved Answer
Step: 1 Unlock blur-text-image
Question Has Been Solved by an Expert!

Get step-by-step solutions from verified subject matter experts

Step: 2 Unlock
Step: 3 Unlock

Students Have Also Explored These Related Databases Questions!

Q:

Die yield = Wafer yield x 1/(1 + Defects per unit area x Die area) N Chip Die Size (mm 2) Estimated defect rate (per cm 2) N Manufacturing size (nm) Transistors (billion) Cores BlueDragon 180 0.03 12...

Q:

Die yield = Wafer yield x 1/(1 + Defects per unit area x Die area) N Chip Die Size (mm 2) Estimated defect rate (per cm 2) N Manufacturing size (nm) Transistors (billion) Cores BlueDragon 180 0.03 12...

Q:

Die yield = Wafer yield x 1/(1 + Defects per unit area x Die area) N Chip Die Size (mm 2) Estimated defect rate (per cm 2) N Manufacturing size (nm) Transistors (billion) Cores BlueDragon 180 0.03 12...

Q:

Chip Phoenix 8 Die Size ( mm 2 ) 2 0 0 Estimated defect rate ( per cm 2 ) 0 . 0 4 N 4 Manufacturing size ( nm ) 7 . 5 Transistors ( billion ) 1 2 Cores 8 Your colleague at AMD suggests that, since...

Q:

1.10 (24 pts) We have begun fabrication of a 300cm wafer, designed to produce big System-on-Chip dies, 20mm x 20mm. a. What's the size of the area of each wafer: cm? b. How many whole and fractional...

Q:

Please download image to be able to zoom in to the question as needed 1.10 (24 pts) We have begun fabrication of a 300cm wafer, designed to produce big System-on-Chip dies, 20mm x 20mm. a. What's the...

Q:

You are trying to figure out whether to construct a new fabrication facility for your IBM Power5 chips. It costs $1.5 billion to build a new fabrication facility. The benefit of the new fabrication...

Q:

You are trying to figure out whether to construct a new fabrication facility for your IBM Power5 chips. It costs $1.5 billion to build a new fabrication facility. The benefit of the new fabrication...

Q:

Design parameters: Let L = the side length of a single die. (in cm) Let A = L2 = the area of a single die.( in cm?) Let Cd = the cost of a single die. (in $) Manufacturer Parameters: Let Cw = cost of...

Q:

1. You are working at a fabless company, and need to find a foundry to make 3,000 chips. This is a small production run. You talk to two potential vendors. Vendor A says that they are using a...

Q:

Equity as an Option Rackin Pinion Corporations assets are currently worth $1,040. In one year, they will be worth either $1,000 or $1,350. The risk-free interest rate is 6 percent. Suppose Rackin...

Q:

Differentiate y=(x-2) / (x + 1)(2x-1) with respect to x and evaluate dy/dx when x = 3.

Q:

Why is the AIDA model a form of persuasive communication?

Q:

(b) [5] For the first 3 EWG listed, the o-values are significantly higher than the Op. The CF3 group stands out since it has a o-value very similar to its op value. The op and o values for some...

Q:

Explain the difference between Job Analysis, Job Classification, and Job Evaluation.

Q:

What does Processing of an OLAP Cube accomplish?

Q:

After designing a Multidimensional Database in Visual Studio, what are the next steps that build the Database in the Analysis Services Instance? How is the build out of the Analytical Services...