Question: HAL Computer has a printed circuit board plant that contains a line with two stations. The first station (applied resistor) applies a photoresist to the

HAL Computer has a printed circuit board plant that contains a line with two stations. The first station (applied resistor) applies a photoresist to the circuit boards. The second station (exposure) exposes the plates to ultraviolet light to produce a circuit pattern that is subsequently etched onto the plates. Since the exposure operation must take place in a cleanroom, the space for WIP between the two processes is limited to 25 jobs. Capacity calculations show the bottleneck to be exposed, which requires an average of 25 minutes to process a job, with an SCV of one. Resist apply requires 21 minutes per job, with an SCV of 0.25. Additionally (and not included in the process times above), exposure has a mean time to failure (MTTF) of 3.33 hours and a mean time to repair (MTTR) of 10 minutes, while applied resistance has an MTTF of 48 hours and an 8 hour MTTR. Jobs arrive to withstand the application with a fair amount of variability, so we assume an SCV arrival c2 a of one. The desired production rate is 2.4 jobs per hour. Assume that the first station holds a finite amount of materials. a) Can HP meet this production target? b) Calculate the queuing times and the SCV for the process time for the two stations. c) Determine the variabilities of arrival time, departure time and process time. d) Show (with numbers) that despite the bottleneck being at the 2nd station, the biggest problem on the line is the 1st station. (Hint: show with calculations that the main source of failures is the first station)

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