$**$NOTE$**$ pick your own material and dimentions

Design a cooling system for a microprocessor by analyzing heat dissipation using both extemal

and intemal convection. The goal is to maintain the processor at a safe operating temperature under

peak load conditions.

Project Description:

You are tasked with designing a heat sink and airfow system to cool a microprocessor that

generates $75$ W of heat during operation. The surface temperature of the microprocessor is $600,$

and the temperature of the air is assumed to bs $25^($@$).$ The design should involve:

External Convection Analysis:

Analyze heat dissipation from a heat sink with extended surfaces $($cg$,$ fins$).$

Evaluate the performance of different fin geometries $($rectangular vs$,$ pin fims$).$

Incorporate forced convection by a fan.

Steps and Deliverables:

L$.$ Heat Sink Design and Analysis:

Use extemal forced convection principles to evalumte heat transfer from the heat sink.

Use correlations for flat plates and finned surfaces to calculatic convective heat transfer

cocfficients

Specify the optimal heat sink dimensions and fan power.

Airflow Design

Calculate the Reynolds number for the airflow.

Evaluate whether the flow is laminar or furbulent.

Determine the required airflow velocity to achieve sufficient cooling.