Objectives

To explore the technological improvements in $3$D stacked memory architectures and their effects on the performance of high$-$end computing systems and personal devices.

To understand the significance of advanced memory solutions in the broader context of global computing needs, economic feasibility, environmental implications, and societal benefits.

To examine contemporary issues and challenges in the design and implementation of $3$D stacked memory within computer engineering.

Improve lifelong learning skills.

Procedure

Students will research the latest trends and state$-$of$-$the$-$art developments in $3$D stacked memory, such as High Bandwidth Memory $($HBM$)$ and Wide I$/$O$,$ and their role in addressing the memory wall challenge in high$-$performance computing.

The research will assess the impact of $3$D stacked memory on a global scale, looking at economic aspects like production costs and market adoption; environmental considerations, including energy consumption and heat dissipation; and societal implications, such as the potential for advanced computing capabilities in various sectors $($e$.$g$.,$ healthcare, finance, education$).$

Plan