Overview

This project requires designing a liquid cooling system for computer chips, with a focus on

applications within AI computing facilities. The challenge is to create a system that

efficiently manages the high heat output associated with intensive computational tasks in

AI development, ensuring optimal performance and reliability of computing hardware.

The significance of this design project is underscored by the demanding thermal

management needs of AI computing facilities. Given the high thermal densities generated

by $AI$ algorithms and processes, these environments require advanced cooling solutions to

maintain system stability and performance.

Project Objectives

Design Suitability: Develop a cooling system that meets the specific needs of $AI$

computing, optimizing for efficiency, reliability, and sustainability.

Design Procedure: Outline a clear and logical design process, from initial research to

final solution, emphasizing innovative approaches to liquid cooling.

Alternatives Development: Explore various cooling technologies and configurations,

providing a comparative analysis to justify the selected design.

Final Solution Justification: Demonstrate the effectiveness of the chosen design

through simulations, calculations, or empirical data, focusing on its application in AI

computing environments.

Consideration of Factors: Address how the design impacts public health, safety, and

welfare, along with its environmental, social, and economic implications, particularly

in the context of AI computing.

Engineering Standards and Codes: Adhere to relevant ASHRAE, IEEE, and ISO

standards, ensuring the design is safe, efficient, and compliant with industry best

practices.

AI$-$specific Considerations: Discuss the unique requirements of AI computing

facilities, such as high thermal loads and the need for stable operating conditions under

continuous, intensive computational workloads.