Question: Problem 1 : Design A silicon wafer is 5 0 0 mm thick. The front surface is unknown size.The sides of the window are parallel

Problem 1: Design A silicon wafer is 500 mm thick. The front surface is unknown size.The sides of the window are parallel to by 80 mm 61007. A mask consists of a rectangular window of 61107. After through-wafer etch,a window (50 mm ) is formed on the other side of the wafer. Find the size of the original mask window.The under cut rate is negligible.

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