Special Process Requirement$/$Major Issue:

Thick $2$ um AlCu Metal Layer

Standard Process:

Usually Metal layer is only $0\mathrm{.}5$ um thick

Current Process Bottle$-$neck:

Long Deposition Time and Heating

Metal Etch Residue

Defect Observed after Module Process:

Metal Extrusion $+$Cu Precipitation $+$ Spires

Discussion:

Dep Module : Dep technique? Process Change? : Qnl

Etch Module : Cu Precipitation issues in Etching? : Qn$2$

Thick Metal Etch Issues $-$ Optimization $-$ Process Change? : Qn$3$

$3.$ Litho Module : Any Process Optimization $-$ Litho Process any bottle$-$neck: Qn$4$

$4.$ Metrology: Any Tools to sort the solution, identify the defect issue, root$-$cause?: Qns