Question: The data were collected in a study conducted in a semiconductor manufacturing plant. In this plant the finished semiconductor is wire bonded to a frame.

The data were collected in a study conducted in a semiconductor manufacturing plant. In this plant the finished semiconductor is wire bonded to a frame. The goal of the study was to relate a pull strength to a wire length and a die height. The variables obtained for each subject were a pull strength (a measure of the amount of force required to break a bond), a wire length, and a height of a die. What is the type of this data?

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