The goal of this project is to design a suitable and sustainable cooling system at Tambient=40C...

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The goal of this project is to design a suitable and sustainable cooling system at Tambient=40C for a 400W ASIC and its 4qty x 5W memory in a 1U (1.75in Tall) system using water (Tinlet=40C) and air at Tinlet=40C. *The maximum ASIC temperature is Tcase=110C and the DDR memory pcb must have a maximum Tcase-90C. If liquid cooled the customer would like Tj=90C. *For the ASIC the following can be used for thermal resistances: Ojc=0.04C/W and Ojb=0.1C/W. *For the heatsink Oint=.015C/W. *The ASIC size is 40mm x 40mm x 3mm. *The DDR/ea size: 133mmx25mmx3mm thick (Flat plate ext. flow, q" Const for Tsurface calcs). *For the faceplate venting use a vent that is 1U tall x 200mm wide and is 60% Open (almost the full size of the chassis front). *Main PCB is 3.5mm thick and composed of 30oz /ft^2 of Cu (0.5oz signal and 1.0oz Power/Ground Cu layers (Not Reqd, but Added Info) It will be required to conduct a calculation to determine if this chip package can be cooled with a maximum heatsink size of 175mm wide x 175mm long x 35mm tall (for air) and an internal liquid/water cooled heatsink that is 50mm x 50mm x 5mm tall (liquid/water). For the air cooled Baseline heatsink use a 42fins at 0.6mm thick. The goal of this project is to design a suitable and sustainable cooling system at Tambient=40C for a 400W ASIC and its 4qty x 5W memory in a 1U (1.75in Tall) system using water (Tinlet=40C) and air at Tinlet=40C. *The maximum ASIC temperature is Tcase=110C and the DDR memory pcb must have a maximum Tcase-90C. If liquid cooled the customer would like Tj=90C. *For the ASIC the following can be used for thermal resistances: Ojc=0.04C/W and Ojb=0.1C/W. *For the heatsink Oint=.015C/W. *The ASIC size is 40mm x 40mm x 3mm. *The DDR/ea size: 133mmx25mmx3mm thick (Flat plate ext. flow, q" Const for Tsurface calcs). *For the faceplate venting use a vent that is 1U tall x 200mm wide and is 60% Open (almost the full size of the chassis front). *Main PCB is 3.5mm thick and composed of 30oz /ft^2 of Cu (0.5oz signal and 1.0oz Power/Ground Cu layers (Not Reqd, but Added Info) It will be required to conduct a calculation to determine if this chip package can be cooled with a maximum heatsink size of 175mm wide x 175mm long x 35mm tall (for air) and an internal liquid/water cooled heatsink that is 50mm x 50mm x 5mm tall (liquid/water). For the air cooled Baseline heatsink use a 42fins at 0.6mm thick.