In a high-performance computer, silicon chips are actively cooled by water flowing through the ceramic substrate, as shown in the sketch. The chip assembly is inside a case through which air freely circulates.

Consider the following thermodynamic systems (or control volumes), sketching each and showing all the heat interactions with arrows. Labeleach heat interaction to indicate the mode of heat transfer (i.e.,Q̅_cond, Q̅_conv, or Q̅_rad):

A. Silicon chip only

B. Silicon chip and substrate (excluding the water)

C. Ceramic substrate only

D. Ceramic substrate and the flowing water

Water flow passage Air Silicon chip Ceramic substrate Mounting plate