Copper Interconnect Technology(1st Edition)

Authors:

Christoph Steinbruchel ,Barry L Chin

Type:Hardcover/ PaperBack / Loose Leaf
Condition: Used/New

In Stock: 1 Left

Shipment time

Expected shipping within 2 - 3 Days
Access to 35 Million+ Textbooks solutions Free
Ask Unlimited Questions from expert AI-Powered Answers 30 Min Free Tutoring Session
7 days-trial

Total Price:

$0

List Price: $39.00 Savings: $39 (100%)
Access to 30 Million+ solutions
Ask 50 Questions from expert AI-Powered Answers 24/7 Tutor Help Detailed solutions for Copper Interconnect Technology

Price:

$9.99

/month

Book details

ISBN: 0819438979, 978-0819438973

Book publisher: SPIE Publications

Book Price $0 : Copper Interconnect Technology Is Expected To Be A Key Component In The Quest To Create More Powerful CPUs And Memory Chips. This Text Examines The Role Of Copper In Future Interconnects, Presents The Range Of Problems Involved, And Explains How The Solutions Are Being Found.Contents - Introduction - Interconnect Issues - Copper Deposition - Copper Patterning - Interlayer Dielectrics - Cu/ILD Barriers - Current Practice - Index