Electromigration Modeling At Circuit Layout Level(2013th Edition)

Authors:

Cher Ming Tan ,Feifei He

Type:Hardcover/ PaperBack / Loose Leaf
Condition: Used/New

In Stock: 2 Left

Shipment time

Expected shipping within 2 - 3 Days
Access to 35 Million+ Textbooks solutions Free
Ask Unlimited Questions from expert AI-Powered Answers 30 Min Free Tutoring Session
7 days-trial

Total Price:

$0

List Price: $41.99 Savings: $41.99 (100%)
Access to 30 Million+ solutions
Ask 50 Questions from expert AI-Powered Answers 24/7 Tutor Help Detailed solutions for Electromigration Modeling At Circuit Layout Level

Price:

$9.99

/month

Book details

ISBN: 9814451207, 978-9814451208

Book publisher: Springer

Offer Just for You!: Buy 2 books before the end of January and enter our lucky draw.

Book Price $0 : Integrated Circuit (IC) Reliability Is Of Increasing Concern In Present-day IC Technology Where The Interconnect Failures Significantly Increases The Failure Rate For ICs With Decreasing Interconnect Dimension And Increasing Number Of Interconnect Levels. Electromigration (EM) Of Interconnects Has Now Become The Dominant Failure Mechanism That Determines The Circuit Reliability. This Brief Addresses The Readers To The Necessity Of 3D Real Circuit Modelling In Order To Evaluate The EM Of Interconnect System In ICs, And How They Can Create Such Models For Their Own Applications. A 3-dimensional (3D) Electro-thermo-structural Model As Opposed To The Conventional Current Density Based 2-dimensional (2D) Models Is Presented At Circuit-layout Level.