Microelectronics Packaging Handbook Part 2 Semiconductor Packaging(1st Edition)
Authors:
R R Tummala ,Eugene J Rymaszewski ,Alan G Klopfenstein
Type:Hardcover/ PaperBack / Loose Leaf
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In Stock: 2 Left
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Book details
ISBN: 0412084414, 978-0412084416
Book publisher: Springer





























