Semiconductor Packaging Materials Interaction And Reliability(1st Edition)
Authors:
Andrea Chen ,Randy Hsiao Yu Lo
In Stock: 1 Left
Shipment time
Expected shipping within 2 - 3 DaysPopular items with books
Total Price:
$157.94
Solution Manual Includes
Price:
$9.99
Book details
ISBN: B00OD4G8AU, 978-1439862070
Book publisher: CRC Press
Book Price $157.94 : In Semiconductor Manufacturing, Understanding How Various Materials Behave And Interact Is Critical To Making A Reliable And Robust Semiconductor Package. Semiconductor Packaging: Materials Interaction And Reliability Provides A Fundamental Understanding Of The Underlying Physical Properties Of The Materials Used In A Semiconductor Package. By Tying Together The Disparate Elements Essential To A Semiconductor Package, The Authors Show How All The Parts Fit And Work Together To Provide Durable Protection For The Integrated Circuit Chip Within As Well As A Means For The Chip To Communicate With The Outside World. The Text Also Covers Packaging Materials For MEMS, Solar Technology, And LEDs And Explores Future Trends In Semiconductor Packages.
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