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Thermal And Structural Electronic Packaging Analysis For Space And Extreme Environments(1st Edition)

Authors:

Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich

Free thermal and structural electronic packaging analysis for space and extreme environments 1st edition juan
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Cover Type:Paperback
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Book details

ISBN: 1032160810, 978-1032160818

Book publisher: CRC Press