Question: The bond strength when mounting an integrated circuit on a metalized glass substrate was studied as a function of factor A = adhesive type, factor

The bond strength when mounting an integrated circuit on a metalized glass substrate was studied as a function of factor A = adhesive type, factor B = curve time, and factor C = conductor material (copper and nickel). The data follows, along with an ANOVA table from Minitab. What conclusions can you draw from the data?

Analysis of Variance for strength

076390 260942 43391 78888 3-02 48 35 3 788 655196 728455 5885 2 708335 743824 2 3 23 Source Adhesive Curetime Conmater Adhes curet Adhe s * conm Curet* conm Adh curet conm 4 33.298 8.325 1.07 0.398 Error Total DF MS 2 101.317 50.659 6.54 0.007 2 151.31775.659 9.76 0.001 0.722 0.722 0.09 0-764 4 30.5267.632 0.98 0.441 8.015 4.008 0.52 0.605 5.952 2.976 0.38 0.687 2 2 18 139.515 7.751 35 470.663

Step by Step Solution

★★★★★

3.43 Rating (172 Votes )

There are 3 Steps involved in it

1 Expert Approved Answer

Step: 1 Unlock

Based on the Pvalues in the ANOVA table statistica... View full answer

Question Has Been Solved by an Expert!

Get step-by-step solutions from verified subject matter experts

Step: 2 Unlock

Step: 3 Unlock

Document Format (1 attachment)

1172-M-S-V-A(2737).docx

120 KBs Word File

Students Have Also Explored These Related Statistics Questions!

In an experiment to compare the bond strength of two different adhesives, each adhesive was used in five bondings of two surfaces, and the force necessary to separate the surfaces was determined for...

When bonding teeth, ortho dontists must maintain a dry field. A new bonding adhesive (called "Smartbond") has been developed to eliminate the necessity of a dry field. However, there is concern that...

An experimenter is interested in examining the bond strength of a new adhesive product prepared under three different temperature settings (280 F, 300 F, and 320 F) and four different pressure...

59. The bond strength when mounting an integrated circuit on a metalized glass substrate was studied as a function of factor A adhesive type, factor B cure time, and factor C conductor material...

The bond strength when mounting an integrated circuit on a metalized glass substrate was studied as a function of factor A adhesive type, factor B curve time, and factor C conductor material...

2. A 2-1 fractional factorial was conducted to study the effects of four factors on the bond strength of an integrated circuit mounted on metallized glass substrate. The four factors and their...

1. Referring to the data in Exhibit 5, is the process capable of meeting GME's internal wire-bond strength requirement of at least seven grams? Use Cpk in explaining your answer. 2. Referring to the...

Bond Strength of Bundled High Yield Strength Deformed Bars in Civil Engineering In civil engineering, the bond strength of bundled high yield strength deformed bars refers to the ability of multiple...

i am having trouble with these two math responses For the following questions, please identify as independent data sets or matched paired data sets (For the week 13 online participation 2 of 2, we...

Case Study: Development Length Requirements in Seismic Force-Resisting Members Introduction: In civil engineering, the development length of reinforcement bars plays a critical role in ensuring the...

1.) Subtract, and if possible simplify. Please list the step by step process. (1/y + 1/x) / (x/y - y/x) 2.) Add and if possible simplify. Please list the step by step process. (4z+2 / 3z^2-3z-60) +...

Given that f(1) = 2, f'(1) = - 1, g(1) = 0 and g'(1) = 1, find F'(1) where F(x) = f(x) cos g(x).

2. Active Policy Why do proponents of active policy recommend government intervention to close an expansionary gap?

What type of marketing research would be needed to help Sears decide whether it should aggressively expand in rural areas in the United States?

=+ Based on this, compute the sample correlation coefficient and interpret its value. How would you characterize this correlationas strong, moderate, or weak?

=+12. Historically, reinforced concrete structures used externally bonded steel plates to add strength and support. Recently, fiber reinforced polymer (FRP) plates have been used instead of steel...

=+the article Interfacial Bond Strength Characteristics of FRP and RC Substrate (J. of Compos. Constr., 2012: 3543), investigators developed a method to mathematically model bond strength between a...

Master it! Chapter 7 Chapter 7 Chapter 7 - Master It! In practice, the use of the dividend discount model is refined from the method we presented in the textbook. Many analysts will estimate the...

a bond's price/coupon payment /par value a bond issuer is said liquidation/bankruptcy/default a bond contract sinking fundation provision/call provision/convertible provision a bond's call...

A manufacturer of video games develops a new game. The development costs are $850,000 immediately and another $850,000 at the end of two years. When the game is released, it is expected to make $1.2...