The bond strength when mounting an integrated circuit on a metalized glass substrate was studied as a function of factor A = adhesive type, factor B = curve time, and factor C = conductor material (copper and nickel). The data follows, along with an ANOVA table from Minitab. What conclusions can you draw from the data?

Analysis of Variance for strength

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076390 260942 43391 78888 3-02 48 35 3 788 655196 728455 5885 2 708335 743824 2 3 23 Source Adhesive Curetime Conmater Adhes curet Adhe s * conm Curet* conm Adh curet conm 4 33.298 8.325 1.07 0.398 Error Total DF MS 2 101.317 50.659 6.54 0.007 2 151.31775.659 9.76 0.001 0.722 0.722 0.09 0-764 4 30.5267.632 0.98 0.441 8.015 4.008 0.52 0.605 5.952 2.976 0.38 0.687 2 2 18 139.515 7.751 35 470.663