An array of sixteen silicon chips arranged in 2 rows are insulated at the bottom and cooled by air flowing in forced convection over the top. The array can be located either with its long side or its short side facing the cooling air. If each chip is 10 mm × 10 mm in surface area and dissipates the same power, calculate the rate of maximum power dissipation permissible for both possible arrangements if the maximum permissible surface temperature of the chips is 100?C. What would be the effect of a turbulator on the leading edge to trip the boundary layer into turbulent flow? The air temperature is 30?C and its velocity is 25 m/s.GIVENAn array of sixteen silicon chips cooled by air flowing over the topBottom is insulatedDimensions of each chip = 10 mm × 10 mm = 0.01 m × 0.01 mArray is 2 rows, 8 chips per rowEach chip dissipates the same power ( qG /A)Maximum surface temperature (Ts) = 100?CAir temperature (T??) = 30?CAir velocity (U??) = 25 m/sASSUMPTIONSSteadystate

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Alr Case(b) Case (a) Alr U.- 25 m/s T=30°C Insulated