An electronic device is to be cooled by air flowing over aluminum fins attached to its lower surface as shown

U?? = 10m/sT?? Air = 20?CThe device dissipates 5 W and the thermal contact resistance between the lower surface of the device and the upper surface of the cooling fin assembly is 0.1 cm2 K/W. If the device is at a uniform temperature and insulated at the top, estimate that temperature under steady state.GIVENElectronic device attached to aluminum fins as shown aboveAir velocity (U??) = 10 m/sAir temperature (T??) = 20?CThe device temperature is uniformTop is insulatedHeat dissipation from the device (qG) = 5 WContact resistance between the device and the fins (Ri) = 0.1 cm2 K/WASSUMPTIONSFin material is pure aluminumHeat transfer is one dimensional through the 3 mm thickness of aluminumHeat loss through the insulation is negligibleConvection from the fins may be approximated as parallel flow over a flat plateHeat loss from the edges of the device is negligibleHeat loss from the front and back edges of the fins is negligible

Bectronic Devlce Insulated 3 mm Aluminum Ans 6 mm 10 mm U. 3 mm 1 mm 9 mm