Consider the cooling arrangement for the very large-scale integration (VLSI) chip of Problem 4.75. Use the finite-element

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Consider the cooling arrangement for the very large-scale integration (VLSI) chip of Problem 4.75. Use the finite-element method of FEHT to obtain the following results.

(a) Determine the temperature distribution in the chip-substrate system. Will the maximum temperature exceed 85°C?

(b) Using the FEHT model developed for part (a), determine the volumetric heating rate that yields a maximum temperature of 85°C.

(c) What effect would reducing the substrate thickness have on the maximum operating temperature? For a volumetric generation rate of q = 10⁷ W/m³ reduce the thickness of the substrate from 12 mm to 6 mm, keeping all other dimensions unchanged. What is the maximum system temperature for these conditions? What fraction of the chip power generation is removed by convection directly from the chip surface?

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KNOWN Silicon chip mounted in a dielectric substrate One surface of system is convectively cooled while the remaining surfaces are well insulated See Problem 475 Use the finiteelement software FEHT as ...View the full answer

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Fundamentals of Heat and Mass Transfer

ISBN: 978-0471457282

6th Edition

Authors: Incropera, Dewitt, Bergman, Lavine

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Question Posted: Sep 24, 2010 05:21 AM

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Consider the cooling arrangement for the very large-scale integration (VLSI) chip of Problem 4.75. Use the finite-element

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KNOWN Silicon chip mounted in a dielectric substrate One surface of system is convectively cooled while the remaining surfaces are well insulated See Problem 475 Use the finiteelement software FEHT as ...View the full answer

Fundamentals of Heat and Mass Transfer

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