Question: Consider the cooling arrangement for the very large-scale integration (VLSI) chip of Problem 4.75. Use the finite-element method of FEHT to obtain the following results.
Consider the cooling arrangement for the very large-scale integration (VLSI) chip of Problem 4.75. Use the finite-element method of FEHT to obtain the following results.
(a) Determine the temperature distribution in the chip-substrate system. Will the maximum temperature exceed 85°C?
(b) Using the FEHT model developed for part (a), determine the volumetric heating rate that yields a maximum temperature of 85°C.
(c) What effect would reducing the substrate thickness have on the maximum operating temperature? For a volumetric generation rate of q = 107 W/m3 reduce the thickness of the substrate from 12 mm to 6 mm, keeping all other dimensions unchanged. What is the maximum system temperature for these conditions? What fraction of the chip power generation is removed by convection directly from the chip surface?
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KNOWN Silicon chip mounted in a dielectric substrate One surface of system is convectively cooled while the remaining surfaces are well insulated See Problem 475 Use the finiteelement software FEHT as ... View full answer
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