In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure
In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature To, a radiant source is used to provide a heat flux qo (W/m2), all of which is absorbed at the bonded surface. The back of the substrate is maintained at T1 while the free surface of the film is exposed to air at T∞ and a convection heat transfer coefficient h.
(a) Show the thermal circuit representing the steady-state heat transfer situation. Be sure to label all elements, nodes, and heat rates. Leave in symbolic form.
(b) Assume the following conditions: T∞ = 20°C, h = 50 W/m2 ∙ K, and T1 = 30°C. Calculate the heat flux qo that is required to maintain the bonded surface at To = 60°C.
(c) Compute and plot the required heat flux as a function of the film thickness for 0 ≤ Lf ≤ 1 mm.
(d) If the film is not transparent and all of the radiant heat flux is absorbed at its upper surface, determine the heat flux required to achieve bonding. Plot your results as a function of Lf for 0 ≤ Lf ≤ mm.
This problem has been solved!
Step by Step Answer: