Exercise 1.11 The following table shows manufacturing data for various processors.

Wafer diameter Dies per wafer Defects per unit area cost per wafer

a. 15 cm 90 0.018 defects/cm2 10

b. 25 cm 140 0.024 defects/cm2 20 1.11.1 [10] <1.7> Find the yield.

1.11.2 [5] <1.7> Find the cost per die.

1.11.3 [10] <1.7> If the number of dies per wafer is increased by 10% and the defects per area unit increases by 15%, fi nd the die area and yield.

Suppose that, with the evolution of the electronic devices manufacturing technology, the yield varies as shown in the following table.

T1 T2 T3 T4 yield 0.85 0.89 0.92 0.95 1.11.4 [10] <1.7> Find the defects per area unit for each technology given a die area of 200 mm2.

1.11.5 [5] <1.7> Represent graphically the variation of the yield together with the variation of defects per unit area.