A square chip of size \(8 \mathrm{~mm}\) is mounted on a substrate with the top surface being exposed to a coolant flow at \(20^{\circ} \mathrm{C}\). All other surfaces of the chip are insulated. The chip temperature must not exceed \(80^{\circ} \mathrm{C}\) in order for the chip to function properly. Determine the maximum allowable power, which can be applied to the chip if the coolant is air with a heat transfer coefficient of \(250 \mathrm{~W} / \mathrm{m}^{2} \mathrm{~K}\). If the coolant is a dielectric liquid with a heat transfer coefficient of \(2500 \mathrm{~W} / \mathrm{m}^{2} \mathrm{~K}\), how much additional power can be dissipated compared to air cooling?